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Thermal Design and Layout of Printed Circuit Boards for High Density Modular Power Systems

vicor thermal design

The design of power networks for high performance computing and artificial intelligence applications is a complex challenge due to the increasing power needs in terms of current levels and voltage accuracy required by today's advanced processors. . Therefore, the most modern techniques for modeling and estimation of thermal design and power networks are required, as well as advanced criteria for selection and placement of components. This article explains the principles of high-performance printed circuit board layout, thermal design methods, an overview of the power network, and strategies for routing high currents with low impedance, as well as providing important insights into capacitance design. effective decoupling.