Home Instrumentation Harwin Simplifies Miniature EMC Shielding

Harwin Simplifies Miniature EMC Shielding

Very low profile clamps facilitate self-assembly

Harwin has expanded its popular EZBoardware range with the introduction of three new RFI shielding clamps suitable for small-sized, low-profile shielding enclosures with thicknesses from 0,15 to 1,0mm. Among its novelties there are two clamps with a length of only 3,9 mm that allow users to install small-sized housings on the plate thanks to this economical method.

The range of clamps now available also includes the S0961-46R, specially designed to offer higher retention forces on the shielding casing, typically 30% higher, and are ideal for users seeking maximum shielding casing retention at the plate.

EZShield Casing Clamps are supplied on tapes and reels and are designed to automatically position and mount onto the plate, thus avoiding time consuming, costly and potentially damaging downstream operations. The clamps provide secure retention of shield housings against RFI/EMI and are shock and vibration resistant, as well as easy to remove and replace, making them ideal for adjustments, repairs and maintenance.

Paul Gillam, Product Manager, commented: “With their small footprint and profiles starting at 0,8mm in height, these versatile clamps offer a very economical method of attaching shield housings and feeder bars to a substrate of the printed circuit board. Automatic clamp placement eliminates soldering and desoldering operations after mounting, significantly reducing solder damage to the board. The shielding housing format used in these clips is a simple five-sided box design rather than the more expensive fence and cover formats proposed by other competitors.”

Its applications are found in numerous markets, from consumer electronics to industrial, instrumentation and control systems. Basically, EZShield housing clamps fit any market that uses RF devices or requires shielding from interference. Some typical examples are radio systems, wireless equipment and consumer electronics, where it is necessary to combine effective and low-cost retention of the housing with good shielding performance.