Rich and exciting SOC graphics, full HSA 1.0 support, and even more performance from 12W
congatec AG presents the new COM Express basic modules at the time of the launch of the new generation of high-end embedded processors from AMD. The new AMD Embedded R-series conga-TR3 modules with dual or quad-core SOCs offer not only a much more scalable TDP from 12 to 35W than previous modules and significantly improved performance per watt, but also two more new features Highlights: Extremely high-performance AMD Radeon™ graphics, as well as full support of the HSA 1.0 specification.
“AMD Embedded R-series SOCs feature rich and vibrant graphics, plus very wide scalability up to 12 watts, so they can even be deployed in fully-enclosed, non-forced cooling devices, and therefore particularly robust designs. . This significantly expands the range of applications for our high-end embedded modules based on this platform from AMD”, explains Gerhard Edi, CTO of congatec AG.
“Congatec's new Computer-on-Modules (COM) greatly simplify the implementation of AMD Embedded R-series SOC processors that support DDR4 memory,” said Scott Aylor, corporate vice president and general manager, AMD Embedded Solutions. . Thanks to the standardized form factor, developers are able to integrate these modules right out of the box into existing applications, thus directly benefiting from our new high-end SOC graphics. The scalable TDP to a very low power consumption level of just 12 W, and comprehensive HSA support will also open up many new application areas.”
The target applications of congatec's COM Express modules demand rich and vibrant SOC graphics and/or parallel computing power. These can be found in high-end gaming applications such as pinball machines and arcades, in sophisticated digital signage installations with large-format 4k displays, as well as in image and video analytics in machine vision or imaging systems. medical. Security applications such as video surveillance with facial recognition or firewalls with deep packet inspection, and IoT systems with integrated analysis of large volumes of data (big data) also benefit from the high GPGPU performance of the new congatec modules.
The innovations in detail
The new basic conga-TR3 COM Express modules with 6-pin configuration are equipped with highly integrated AMD Embedded R-series SOC processors and fast memory support DDR4 RAM up to 32GB with optional ECC. The AMD Radeon™ GPU is based on AMD Graphics Core Next (GCN) Generation 3 architecture and delivers up to three independent 4k displays at 60Hz via EDP DisplayPort 1.2 and HDMI 2.0. OpenGL 4.0 and DirectX 12 are also supported, for especially fast 3D graphics based on Windows 10. Integrated hardware accelerators enable energy-efficient HEVC video streaming, in both directions.
Thanks to HSA 1.0 and OpenCL 2.0 support, workloads can be immediately assigned to the most efficient processing unit. In security-critical applications, the AMD Secure Processor offers hardware-accelerated encryption and decryption of RSA, SHA, and AES. Together with the optional Trusted Platform module, the conga-TR3 therefore offers high security for IoT, big data and telecom applications.
The new congatec modules support the COM Express type 6 pin configuration with PEG 3.0 x8, Gigabit Ethernet, 4x USB 3.0 / 2.0, 4x USB 2.0, SPI, LPC, as well as I²C, SDIO and 2x UART. Operating system support is offered for Linux and Microsoft Windows 10, 8.1, and optionally Windows 7. Numerous accessories simplify the design completing the offering.
Datasheet and more information on the conga-TR3 module available at: http://www.congatec.com/products/com-express-type6/conga-tr3.html
