The new AMD Ryzen™ Embedded V1000 processors set a powerful new benchmark for embedded graphics and processor performance. With Rugged COM Express (RCE) modules, MEN Mikro Elektronik makes processors suitable for use in extreme environmental conditions and critical high-security and high-availability applications. The modules are suitable for operation without forced cooling even above the TDP limit of 35 watts, which is normally the point at which active cooling becomes mandatory.
Despite regular annual processor releases, performance gains in the high-end embedded sector have been marginal in recent years. With AMD Ryzen Embedded V1000 processors, momentum has returned to the market. Thanks to the new Zen microarchitecture, AMD has been able to increase instructions per clock cycle by up to 52% in its new family of processors. And the added availability of concurrent multi-threading has more than doubled performance compared to predecessor AM Embedded R-Series (Merlin Falcon) processors.
Highest Integrated Graphics Performance on the Market
With up to 3,6 TFLOPs, the graphics offer truly unmatched performance. Until a few years ago, this level of performance was exclusive to high-end graphics cards with several hundred watts of power dissipation. With the AMD Ryzen V1000 family, this level of performance is available for embedded processors with integrated graphics. Compared to the predecessor Merlin Falcon, the graphics are twice as powerful. Looking beyond AMD's horizon, the graphics of up to 11 compute units are even three times more powerful than the competition. Up to four independent displays can be driven with up to 4K UHD resolution and 10-bit color depth, enabling brilliant presentations. Both HDMI 2.0b and DP / eDP 1.4 are supported.
latest interfaces
Support for the latest interfaces completes the powerful AMD Ryzen Embedded V1000 processor package. This natively includes up to four USB 3.1 Gen 2 interfaces with transfer rates up to 10Gbps, Gigabit Ethernet and up to 16 PCIe Gen 3.0 lanes for generic expansions, 2x SATA Gen 3.0 for storage media and HD audio, plus interfaces typical embeds such as UART bus, GPIO, I2C, LPC, SPI and SM. However, the addition of this comprehensive set of features does not result in higher power consumption, as the TDP of the new embedded AMD Embedded Ryzen V1000 processors starts at 12 watts and scales up to a maximum of 54 watts. This is within the low to normal range for today's high-end embedded processor technology. Thanks to the support of VITA 59, a Rugged COM Express (RCE) module, even the 54-watt version, can be completely cooled without forced ventilation. This is far more than can be achieved with conventional COM Express modules, where the limits are generally 25-35 watts, depending on the size of the module. But what makes RCE different from COM Express? The differences are not great but essential!
Why Rugged COM Express?
Based on the PICMG COM Express standard, RCE modules offer everything that COM Express modules offer. The pin-out and size are identical to allow compatibility with modules from other manufacturers. However, the VITA 59 specification adds an extension for COM Express modules to be embedded in a standard aluminum frame (CCA), which is specified for
The mechanical design of VITA 59 compatible Rugged COM Express modules is significantly more robust than traditional COM Express cooling solutions, offering many benefits from increased stress resistance to higher TDP margins for full passive cooling.
ensure optimal thermal connection. Waste heat is dissipated laterally from hot spots, such as the CPU, memory, and power transformer, through a heat spreader and board (PCB) to the frame, which then dissipates it via conduction directly to the casing enclosure. These measures reduce the thermal resistance of the module to the case, reducing temperature rises by up to 5°C. In general, this leads to lower thermal stress, therefore, among other things, longer service life and, ultimately, reliability. Since this entire concept has been standardized by VITA, Rugged COM Express also maintains full vendor independence and a long-term service life that allow the module together with its standardized aluminum frame to be exchanged at any time.
Cooling without forced ventilation even at 54 watts
As mentioned above, VITA 59 compatible COM Express modules do not require forced cooling to cool AMD Ryzen Embedded V1000 processors, even when the device outputs 54 watts. This makes such high performance systems much less susceptible to failure than systems cooled by forced ventilation. As a result, Rugged COM Express is perfect for systems that need to combine high-end embedded performance with high availability, and where the use of active fans is not an option. Therefore, it is an ideal foundation for solving a multitude of new computational and visualization tasks in harsh environments. The new RCE modules are particularly ideal for use in road, rail and commercial vehicles.
This is based on the creation of the standard, because originally Rugged COM Express was mainly developed for the railway sector, since the cooling concept meets the requirements of EN 50155, where resistance to temperature fluctuations in an extended temperature range is important. Therefore, it not only targets the high-performance sector, but also low-power designs. At the same time, the RCE modules also offer significant protection against high electromagnetic compatibility (EMC), as the aluminum housing protects the electronics against incoming and outgoing electromagnetic radiation from all sides. In addition, varnishing, which is a protective coating for the modules, provides reliable protection against environmental agents such as dust, humidity or even chemicals. The secure fixing of the frame on the support plate also provides a particularly high resistance to shock and vibration. Range up to 5G for vibration and up to 50G for downloads are realistic. All of these features predestine Rugged COM Express for use in virtually all in-vehicle applications: on-road, on-road and off-road.
Embedded Applications for AMD Ryzen Embedded Processors
Reflecting the enormous performance bandwidth of processors from 15 to 54 watts, the fields of application for the new RCE modules are extremely diverse. In the high-end sector, situational awareness applications, for example artificial intelligence route monitoring for traffic sign recognition or automatic brake activation in the event of anomalies such as fallen trees or other obstacles on the road, are particularly appropriate for this device. Of course, the same applies to any mobile application, from collaborative robots and autonomous intralogistics systems to self-driving cars, these vehicles are exposed to large temperature fluctuations, as well as shock and vibration. In such applications, the full GPU support of AMD processors, which can also be combined with discrete AMD GPUs, is an advantage, along with the high scalability of AMD integrated graphics. In the lower performance segment, the range of applications extends to multi-screen cockpit systems with four independent displays for autonomous vehicles and multi-functional edge systems with virtual machines or even robust mobile devices for maintenance using augmented reality and much more. .
A high-performance module for extremes
Such modules can be purchased, for example, from MEN Mikro Elektronik, the leading manufacturer and initiator of the VITA 59 specification for COM Express. The company's new CB71C module is fully compatible with the COM Express Type 6 pin-out and is available as an ultra-robust Rugged COM Express module that includes a CCA aluminum frame that acts as a heat sink and shields against harmful environmental effects. . With a freely scalable selection of long-term available AMD Ryzen Embedded V1000 processors with TDPs from 15 to 54 watts and available with up to 32GB of soldered DDR4 RAM, with optional ECC for security critical applications.
An onboard 16 GB eMMC provides space for the operating system and applications. With 11x PCIe Gen 3.0, 3x USB 3.1. Gen 2 (10 Gbps), 3x USB 2.0 as well as 4x DisplayPort and 1x Gigabit Ethernet, the module supports all high-speed interfaces of the COM Express Type 6 specification. In addition, the CB71C integrates a powerful network management controller. board with monitoring functions for safety critical applications. To ensure high data and application security, the new Computer-on-Module has a Trusted Platform Module (TPM) and provides real-time memory encryption on the hardware side to protect against physical and inter-VM memory attacks. .
Is Rugged COM Express the only option?
Certainly not. There are also a variety of applications that can be implemented with standard COM Express Type 6 modules. That is why the new CB71C is also available in the regular CB71 COM Express version. Meeting the same high demands that are placed on Rugged COM Express, it is developed and manufactured to the highest quality assurance standards, such as DIN EN ISO 13485 for quality management and DIN EN ISO 14971 for risk management. These MEN modules do not require any special or complex qualification, as pretty much all that changes is that the “extensions” are removed and the CCA is replaced with a classic COM Express cooling solution. These quality standards are ideal for applications that require high availability, robustness, and quality; or industry-specific certifications that need to be supported by high-quality documentation and generally require an end-to-end audit trail.
Customers for these modules are in industries ranging from medical technology and power plant maintenance to industrial automation, as well as payment, ticketing and vending systems that depend on high quality and long-term stability. term. Incidentally, these two module variants are also manufactured at the company headquarters in Nuremberg and, like all MEN products, are almost the only IT modules worldwide that offer quality "made in Germany" from the start. development to delivery.
