Würth Elektronik is gradually establishing itself as a "One Stop Shop" for thermal interface materials (TIM). Proof of this are the 5 new product families and the expansion of another series, which now offer electronic designers an even greater selection of solutions for thermal bridging between components and heat sinks. Materials that help distribute residual heat over large surfaces are also included. Würth Elektronik offers auxiliary services for each and every one of the solutions such as the customization of shapes and profiles, and with deliveries tailored to the user without minimum order quantities.
Depending on the heat losses and the peculiarities of design and assembly, there are different possibilities to dissipate the heat. Between the heat source and the heat sink or casing, the thermal resistance created between the two must be minimized or avoided. Würth Elektronik now has new solutions for this goal.
Minimize the thermal gap
WE-TTT is a heat conductive and electrically insulating double-sided adhesive tape for use on power semiconductors, graphics processors, chipsets or memory modules. Thanks to the ceramic particles integrated into the adhesive, it achieves a thermal conductivity of 1 W/(m⋅K). WE-TINS (Thermally Conductive Insulator Pad) has been developed to provide a thermal interface between the transistors and the cooling modules, maintaining the electrical insulation. The pads are provided cut to size and are identified by their great mechanical resistance.
WE-PCM (Phase Changing Material) is a simple to use alternative to heat conductive paste. The material molds with heat to perfectly even out the micro-roughness of the contact surfaces that would otherwise create air spaces that would act as thermal insulation. In the case of larger spaces, WE-TGF has proven to be really useful. Würth Elektronik has brought other versions of this ceramic silicone padding to the market, allowing up to ten W/(m⋅K) to be achieved in this way.
expanding the surface
Maximum thermal conductivity performances of up to eighteen hundred W/(m⋅K) on the horizontal axis are possible thanks to WE-TGS graphite sheet. WE-TGFG is a graphite foil wrapped foam pad that can be used as a heat conductive interface when silicone material is not suitable or stable enough and specific shapes are required. The singular characteristic of WE-TGFG devices is that they allow heat to be evacuated horizontally, for example, they could replace copper cylinders for heat transmission.
"Similar products can be found individually at other distributors, but Würth Elektronik offers the full range of the best thermal interface materials, and this is combined with the well-known Würth Elektronik service that is easy and convenient for designers: advice, personalized support and assembly”, asserts Sebastián Mirasol-Menacho, Product Manager EMC Shielding & Thermal Materials at Würth Elektronik eiSos.
