New very small module with Intel processor® Core™ 13th Generation
Tria Technologies announces the Tria™ HMM-RLP module, in a COM-HPC Mini form factor, at Embedded World. It is the first member of Tria’s COM-HPC Mini module family and is ideal for designing systems that demand extraordinary performance and flexible I/O connectivity in the smallest possible space.
The module is based on Intel processors® Core™ 13th Gen H, P or U series processors, delivering scalable, high-end CPU computing performance in a small form factor. This allows system designers to choose from varying degrees of energy efficiency and performance with up to fourteen cores and twenty threads at thermal outputs ranging from 15W to 35W. Additionally, the Intel Iris® Xe Graphics Engine with up to 96 execution units helps accelerate graphics, multimedia, and AI-intensive tasks.
“Embedded World will provide us with the opportunity to explain how we can help customers boost their performance and functionality when designing computing systems with space and cooling constraints,” said Daniel Denzler, Senior Director, Business Line Manager at Tria Technologies. “This makes the card ideal for mission-critical equipment that needs to operate 24/7, even under extreme environmental conditions. This significantly expands our product portfolio targeting key automation, robotics, medical and transportation markets,” added Denzler.
The module features up to 64GB of memory, IBECC (in-band ECC) data protection and optional local NVMe, thus demonstrating its capabilities in demanding applications.
The card features a huge array of high-speed I/O, including PCI Express ports® Gen 4, USB4, USB3.2, USB2.0, Dual Gb Ethernet, MIPI-CSI, SATA and Serial. Various display options allow up to four external displays to be connected via DDI, eDP and USB4 interfaces capable of four independent streams.
Tria guarantees long-term product availability by being designed and manufactured in Germany. The highest investment protection is achieved by full compliance with the open COM-HPC standard. System solutions can easily take advantage of the increased performance and advanced technology by migrating to module generations when they become available in the future.
Tria will be offering demonstrations of the new module, among other initiatives, at Booth 225 in Hall 3A during Embedded World from March 11-13, 2025 in Nuremberg, Germany.
