Congatec Introduces Ultra-Powerful Cooling Solutions for 3,5-inch SBCs
Congatec, a provider of high-performance embedded computing products, introduces three new premium embedded cooling solutions for its 3.5-inch single board computers (SBCs). Based on the PICMG specifications for standardized COM Express heat sinks and thanks to their extra-large size, they offer maximum cooling mass and surface area for extremely powerful 3,5-inch SBC designs.
Heat dissipation is standardized and all solutions feature a massive heat sink, made of lightweight metal, which disperses residual heat from CPU hot spots quickly and effectively. Depending on the TDP, the heatsink can be expanded with finned passive heatsinks or active fan systems. congatec also offers its three cooling solutions in a standardized height, OEMs can implement cooling solutions of identical footprints for comparable TDP requirements in the future. This will make it much easier to scale 3,5-inch SBC-based embedded systems across multiple generations of processors. The first configurations of the new, fully in-house developed cooling solutions are optimized for use with the new conga-JC3,5 370-inch SBCs based on the 8th generation Intel Core processor series (codenamed Whiskey Lake) .
“To make it easy for customers to design embedded systems, our strategy has always been to develop custom, ultra-rugged cooling solutions for all of our form factors, which are standardized and, when cooling is turned on, impress with an extra-long MTBF that doesn't it not only meets but even exceeds all common industry standards. Continuing this strategy, we have now also developed a unique new cooling solution for our 3,5-inch SBCs. It differs significantly from conventional 3,5-inch SBCs, where the processor and I/O are on the same side of the board. By mounting our solution at the bottom of the board, we create significantly more space for massive cooling systems, while also making it easier for developers to design systems, since case connection and internal system airflow they are standardized”, states Martin Danzer, Director Product Management at congatec, explaining the advanced cooling concept for the new 3.5-inch SBCs, which utilize almost the entire surface area of the 146 × 102 mm footprint.
All three cooling systems are designed for 3,5-inch SBCs and have been developed for future processors requiring up to 45 watts of cooling capacity in time-limited cTDP modes. They consist of a heat sink without cooling fins that dissipates residual heat to a case, as well as a passive heat sink with cooling fins and an active cooling variant with an integrated fan. When running high loads, an external system fan is recommended for the passive cooling variant. Active cooling is designed for independent operation.
To make system integration easy and flexible, each of the above cooling solutions is available in threaded and borehole variants. The fan-based active cooling system, used for example in 3,5-inch systems with 7-watt 25th-generation Intel Core i7 processors (i8665-24UE / codename Whiskey Lake), is specifically designed for 7/XNUMX operation in harsh industrial environment conditions, In this complete cooling system, the fans are not only more securely mounted, but also specifically attached to reduce wear.
In addition, the bearings are equipped with a special seal and an additional cover to provide maximum protection for mechanics and lubricants. Using a high-performance synthetic oil as a lubricant, the fan has an MTBF of several decades, and this in the industrial temperature range from -45 to +85°C and with industrial-grade shock and vibration resistance. To learn more about congatec's cooling solutions for the new 3.5-inch SBC ecosystem, visit: https://www.congatec.com/ en/technologies/35-sbc-based-on- 8th-generation-intel-core-mobileprocessors.html
