Open platform-based approach combines modular instrumentation and system design software for RF and mixed-signal production testing
National Instruments today announced the NI Semiconductor Test System (STS) series systems. These PXI-based automated test systems reduce the cost of testing RF and mixed-signal devices by opening up access to NI and off-the-shelf PXI modules in semiconductor production test environments. Compared to conventional semiconductor Automated Test Sets (ATE), STS leads users to experience lower production costs and higher throughput, and can now perform characterization and production with the same test tools. hardware and software. This reduces data correlation time and product-to-market time. “As IC complexity grows exponentially, an affordable ATE that provides optimal test coverage of applications ranging from design verification to end-of-line testing is increasingly important,” he said. Dr. Hans-Peter Kreuter, Senior Design and Application Engineer for Automotive Electrical and Electronic Components at Infineon Technologies. “For mixed-signal testing, PXI-based STS outperforms what we typically see in traditional ATEs with optimal test coverage at very low cost.”
The open and modular architecture of the STS gives engineers access to the cutting edge of PXI instrumentation, unlike traditional ATEs with their closed architecture. This is particularly important for RF and mixed-signal testing, as the requirements of the latest semiconductor technologies often exceed the test coverage provided by traditional ATEs.
Powered by TestStand test management software and LabVIEW system design software, STS are delivered with a complete set of features for semiconductor production environments, including a customizable user interface, operator/tester integration, user-centric programming, the device with pin/channel mapping, reporting in the standard format of test data and integrated multi-location support. Thanks to these features, engineers can rapidly develop, debug, and deploy test programs, shortening total time to market. In addition to incorporating the fully enclosed zero-footprint test head, standard interface, and docking mechanics, the STS are delivered ready for integration into a semiconductor production test cell.
The STS series includes three different models called T1, T2, and T4 that accommodate one, two, and four PXI chassis, respectively. These different sizes, along with software, instrumentation, and mechanical interconnects common to all STS models, give engineers the ability to optimize a wide range of pin count and location requirements. In addition, the scalability of the STS makes it practical to deploy from characterization to production with the advantage not only of cost optimization, but also of the great simplification of data correlation that allows further shortening of lead time. market launch.
To ensure customer success, NI provides training, products, and services worldwide through NI engineering professionals and NI Alliance Partners.
For availability and configuration assistance, contact a local NI sales engineer.
For more information about the NI Semiconductor Test System, visit www.ni.com/sts.
