Samtec COM-HPC for AI, Industrial and IoT Applications
Mouser Electronics, the leading introductory distributor of products with the most extensive selection of semiconductors and electronic components, now offers COM-HPC® interconnect solutions from Samtec. Designed to meet the COM-HPC standard recently introduced by the PCI Industrial Computer Manufacturers Group (PICMG®), Samtec's COM-HPC products are high-performance, high-density connectivity systems for emerging technologies such as artificial intelligence (AI), machine vision, embedded edge computing, cybersecurity, 5G infrastructure and connected cars, industrial automation, Internet of Things (IoT) and other applications.
Samtec COM-HPC interconnect solutions, available from Mouser, are based on Samtec's high-performance AcceleRate® HP matrixes, offering design engineers scalability and enhanced performance for embedded system design and flexibility in deployment. Interface. Equipped with four hundred paired pin connectors (eight hundred pins total), COM-HPC systems offer thirty two Gbps per channel, two thousand eighty eight Gbps per square inch, and four thousand ninety six Gbps maximum stacked up to three hundred W ( from 0 V to XNUMX V), as well as being compatible with current and future interfaces such as PCIe XNUMX (XNUMX GT/s) and XNUMX GB Ethernet.
Ideal for server and user modules, medical, datacom, telecom, IoT and other high speed, high cycle count applications, COM-HPC interconnect solutions are available in 0,635mm and XNUMXmm stack heights and a pitch of XNUMXmm.
For more information on Samtec's COM-HP Interconnect Solutions, visit the Mouser website.
