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VIA collaborates with IK4- IKERLAN to reduce the time to market for M2M solutions

 VIA Technologies, Inc, a leader in innovating energy-efficient computing platforms, today announced its collaboration with IK4-IKERLAN, a premier provider of R&D services for prototyping and project feasibility studies, to develop M2M applications for the large European transport and e-health markets.

VIA and IK4-IKERLAN take advantage of the features and functionalities of the VIA VAB-820 Pico-ITX board to offer a growing range of services aimed at enabling the rapid proliferation of M2M applications in embedded systems for the Internet of Things, including:

• Development of interactive user interfaces

• Personalization of drivers for touch screens

• CANbus compatibility

• Benchmark for validation of various hardware compatibility features

• Linux image customization for 3G or wireless connectivity

“We are pleased to have IK4-IKERLAN as a development partner for the European market” said Tiziano Albani, Director of Business Development in Europe, VIA Technologies, Inc. “The demand for M2M devices to power the Internet of Things is increasing at high speed, and this collaboration will allow us to respond to the growing needs of customers in the transport and e-Health segments”.

“ARM-based systems have great advantages for specific Internet of Things applications, but require specialization and training to take advantage of their full potential”