New µATX server motherboard offers scalability across the entire range of Intel Ice Lake D processors and above
Congatec has expanded its ecosystem of modular edge servers. The new products include a server motherboard in µATX form factor and COM-HPC server modules based on the latest Intel Xeon D (Ice Lake) processors. The new µATX server board for COM-HPC modules has been developed for compact real-time servers used in edge applications and critical infrastructure. The board can be flexibly scaled with congatec's latest high-end COM-HPC server modules. Together with the updated modules, which are equipped with the latest Intel Xeon D-1800 and D-2800 processors, customers receive a ready-to-use µATX platform for applications with high performance requirements in a robust, space-saving design.
With the new µATX motherboard for COM-HPC server modules, congatec increases its commitment as a provider of advanced computing solutions for immediate use in demanding industrial applications.
The ecosystem of COM-HPC modules and µATX motherboards offers original equipment manufacturers (OEMs) a wide range of customization options at the module, board and system level from which developers can freely choose according to their needs. The ecosystem package is tailored to the strict requirements of edge computing and offers powerful, reliable and ready-to-use building blocks in industrial environments. The modular approach shortens time to market for new designs and future-proofs them.
The new µATX conga-HPC/uATX server motherboard offers maximum I/O and expansion options in a compact standard form factor. This makes the board an ideal solution for numerous applications, such as server consolidation for virtual machines (VMs) or edge servers for power microgrids, video processing, facial recognition, security applications, smart city infrastructures, and many more. other apps. The conga-HPC/uATX server offers multiple features to power such applications, including robust communication options with up to 100 GbE and bandwidth, PCIe x8 and x16 expansion to process AI-intensive workloads via GPGPUs or other accelerators. computing, 2x M.2 Key M slots for NVMe SSDs and an M.2 Key B slot for compact AI accelerators or communication modules for WiFi or LTE/5G.
The new conga-HPC/sILL and conga-HPC/sILH server modules take advantage of the latest Intel Ice Lake D-1800 LCC and D-2800 HCC processor series, delivering up to 15% higher performance at the same TDP compared to the previous D-1700/D-2700 series 8. The improved performance per watt of COM-HPC modules is ideal for high-performance applications that were previously limited by their thermal limitation. They also benefit from Intel Speed Select technology, which makes it easier to balance computing performance and the maximum TDP of the system design. The latest processors have up to 22 cores with higher clock speeds to support next-generation edge applications with more performance per watt for more power-efficient and therefore more reliable designs. Scalable edge performance and a modular approach increase flexibility and future-proofing of designs, reduce total cost of ownership, and shorten time to market.
The new COM-HPC server modules impress with their firmware-integrated hypervisor, which makes it particularly easy to evaluate the consolidation of servers with virtual machines. Also for its full real-time capability, providing TCC, TCN and optional SyncE support. This is especially ideal for all networked 5G solutions that require very low latencies and strict clock/frequency synchronization.
For the new COM-HPC server module platform based on the µATX solution, congatec also offers several comprehensive cooling solutions, including passive cooling for small chassis. In addition to customizing the conga-HPC/uATX server motherboard, the service pack also includes implementations of
Customer-specific BIOS/UEFI and real-time hypervisor, as well as expansion with additional IIoT functionalities for scanning purposes.
You can experience these and other innovations at the embedded world fair from April 9 to 11, 2024.
Visit congatec in Hall 3 Stand 241.
