Embedded world preview: congatec presents numerous new developments in high-performance COM modules
Congatec will present new COM (Computer-on-Modules) modules at embedded world (Hall 3, Booth 241). These innovations include the new COM Express modules based on the Intel Core Ultra processor with integrated AI, and firsts based on the innovative technology of both low-power and high-performance x86 processors will also be presented. Presentations will focus on increased performance, energy efficiency, and advanced built-in IIoT and security features, which were not previously part of any existing COM module offerings. This will significantly increase the readiness of COM applications and contribute to the particularly efficient and reliable development of modern, multifunctional and widely connected IIoT and embedded devices, and will differentiate congatec's offering from alternative procurement options.
“IIoT presents OEMs with major challenges, which we, as a COM module supplier, are now addressing with a significantly expanded range of functions of our modules based on COM-HPC, COM Express, SMARC and Qseven. For example, the module's integrated hypervisor technology and IIoT functionality make it easy for solution providers to enrich their applications, providing greater functionality without having to develop or integrate it themselves. We will highlight the added value we offer to OEM customers through these newly created functionalities in embedded world”, says Tim Henrichs, Vice President of Marketing at congatec. At Embedded World we will highlight the added value we offer to OEM customers through these newly created functionalities,” explains Tim Henrichs, Vice President of Marketing at congatec.
OEMs' embedded systems must cover significantly more functionalities to meet all digitalization and IIoT connectivity requirements. congatec addresses these high demands on OEM solutions with its own hypervisor technologies and edge IoT functionalities, among other things. The advantages of the seamless integration of this range of solutions into the extended function set of COM modules will be presented by congatec for the first time at embedded world.
The expanded IIoT functions for COM modules are the logical consequence of the company's value-added strategy: As one of the world's leading brands in embedded systems and edge computing in the field of COM modules, congatec is a pioneer in what is refers to expanded functions and services for more simplified integration of modules based on COM Express, COM HPC, SMARC and Qseven. Its high-performance ecosystem offers sophisticated cooling solutions optimized for each module, motherboards to facilitate application evaluation and design, as well as software support and custom integration services. Additionally, congatec design and testing services save OEMs additional time and work. All of this makes module integration easier and more efficient and offers engineers a high level of design security. Customers benefit from faster time to market and can therefore best master increasingly shorter innovation cycles.
In addition to all functional areas of the processor and form factor functions, congatec modules offer comprehensive efficiency and convenience for OEMs. The new integrated virtualization, digitization and security features set a new benchmark in terms of the range of capabilities of application-ready COM modules, especially for real-time IIoT applications.
You will find more information about the new presentations on the congatec home page for embedded world, which will be updated regularly:
https://www.congatec.com/en/congatec/events/congatec-at-embedded-world-2024/
Please take note of the press conference on the latest news from congatec that will take place on April 9 from 14.00:14.30 p.m. to XNUMX:XNUMX p.m. at the NCC East. We will send you an invitation shortly. Please contact us directly if you are interested in attending the press conference and/or a one-on-one meeting at the booth.
