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Microchip's New Complete Hybrid Power Module Solution for Aviation Electric Applications Reduces Development Time and Weight

hybrid power module

This highly integrated, configurable three-phase power module is the first version in the new family and can be customized using silicon or silicon carbide, thus reducing the size and weight of the solution for electric aircraft.   

Manufacturers of Next Generation Aircraft (More Electric Aircraft, MEA) are trying to convert flight control systems from hydraulic to electric in order to reduce weight and design complexity. To meet the needs for an integrated and configurable power solution for aviation applications, Microchip Technology Inc. today announces a new hybrid power module complete, the first version presented in the new line of power devices that will be available in 12 different models, either with silicon carbide (SiC) MOSFETs or IGBTs (insulated-gate bipolar transistors).

These hybrid power modules are highly integrated power semiconductor devices that reduce the number of components and simplify overall system design. Configurable power devices include a three-phase bridge topology available in SiC or Si semiconductor technologies. Offering a compact design, low weight and low profile, these highly reliable power devices help reduce the size and weight of next-generation electric aircraft.

Another notable feature of these hybrid power modules is the large number of auxiliary power devices, which provide a function that limits transient currents. Other optional capabilities include soft start, solenoid linkage control, regenerative brake switch, and thermal sensors for external monitoring circuitry. Power modules also facilitate the generation of power with a high switching frequency, which allows for smaller and more efficient systems.

The standard voltage of the power modules between 650V and 1200V, with the option of reaching 1700V on request. The device is designed for low inductances, thus increasing power density with power and signal connectors that can be soldered directly to the user's printed circuit board.

"Microchip is committed to developing products that serve to implement more compact and highly efficient systems in aviation," said Leon Gross, corporate vice president of Microchip's discrete power management business unit.

"Hybrid Power Modules offer a complete power solution to our customers designing next-generation aircraft."

Microchip is an experienced provider of complete power solutions. These hybrid power modules are easily configurable with other Microchip products and devices, such as field-programmable gate arrays (FPGAs), memory ICs, motor controllers, and motor monitoring ICs.