- Infineon and Eaton partner to advance solid-state transformer (SST) technology.
- This collaboration responds to the demand for more efficient energy conversion solutions in AI data centers.
- Infineon's silicon carbide power devices help improve the efficiency, power density, and system reliability of Eaton's SST platform.
Infineon Technologies AG will supply silicon carbide (SiC) power devices to Eaton, a smart energy management company, for use in its Medium Voltage Solid State Transformer (MVSST) 2.0 platform, designed for deployment in the Asia-Pacific region. This collaboration contributes to increasing the efficiency and reliability of the power conversion required to connect AI data centers to the electrical grid. It focuses on 800-volt direct current (DC) data center power distribution architectures.
The rapid expansion of AI data centers and increasing energy requirements are driving demand for more efficient methods of connecting high-density computing infrastructure to the grid. At the same time, advancements in medium-voltage DC distribution technologies are accelerating the need for next-generation power conversion solutions that improve efficiency, power density, scalability, and reliability.
“As the energy demands of AI data centers and industrial applications continue to grow, so does the demand for efficient, reliable, and sustainable power conversion,” said Andreas Weisl, executive vice president and head of sales for Infineon’s Industrial & Infrastructure division. “By joining forces with Eaton, we aim to advance solid-state transformer technology and contribute to the development of a more scalable, efficient, and sustainable infrastructure to power the AI data centers of the future.”
“In a context of increasing demands for energy efficiency, system reliability, and scalability in AI data centers, our goal is to drive the development and adoption of SST technology. In doing so, we aim to generate greater value for data center and grid operators, as well as for the renewable energy sector,” said David Zheng, Vice President of Power Quality R&D for Eaton’s Asia-Pacific region. “Infineon’s advanced SiC technology is helping us accelerate the deployment of these next-generation power architectures.”
Designed for high-density IT infrastructures and emerging power distribution architectures for 800 VDC AI data centers, Eaton's MVSST 2.0 platform reduces conversion stages compared to conventional architectures, improving efficiency, power density, and deployment flexibility. As one of the first medium-voltage solid-state transformer platforms to achieve IEC certification, it combines advanced silicon carbide technology with Eaton's expertise in power distribution and conversion to support next-generation power infrastructure.
Looking ahead, Eaton and Infineon are exploring next-generation SST platforms based on 2,3 kV and 3,3 kV SiC power modules to support higher system voltages, greater efficiency, and increased reliability for future AI data centers, power grid modernization, and renewable energy applications.
