OSM-MTK510 module: A 6-core, 5W COM solution designed for extreme endurance and a 10-year lifespan
● Supports MediaTek Genio 510 for intensive workloads and low power consumption
● Offers up to 8GB LPDDR4 RAM and up to 128GB eMMC, 4K graphics support, 30MP ISP camera, and extensive I/O options.
● Designed to withstand temperatures between -40°C and 85°C, with a 10-year life cycle for long-term mission-critical use.
● L-size module compatible with OSM R1.1
ADLINK Technology Inc., announces the launch of the new OSM-MTK510. It is an L-sized OSM R1.1 with a BGA 662 module powered by the MediaTek Genio 510 series processor. The newest OSM solution is designed for efficiency and excels at end-to-end AI workload for real-time decision making and handling complex data processing.
The OSM-MTK510 is backed by a powerful 6-core CPU with 2x Arm Cortex-A78 for demanding tasks and 4x Arm Cortex-A55 for ultra-low power consumption, consuming less than 5W, along with the MediaTek DLA+VPU AI Engine, delivering up to 3,2 TOPS to accelerate AI calculations that enable real-time intelligent decision-making.
With its integrated neural processing unit (NPU), the OSM-MTK510 drives faster AI model inference and optimizes machine learning tasks with exceptional efficiency. It is paired with up to 8GB LPDDR4 RAM and 128GB eMMC to support efficient processing and reliable storage for large datasets and computational AI tasks.
“You can never go wrong with its impressive graphics performance, offering 4K support and a variety of video output options including HDMI/DP, eDP and DSI,” said Henri Parmentier, Senior Product Manager at ADLINK. “It also integrates ISP cameras with 30MP resolution, perfect for machine learning tasks, vision systems and real-time image processing. With 1x GbE, USB 3.0, USB 2.0, I2S audio codec interface and 17x GPIO, ensuring seamless portability across various applications,” he added.
Its rugged design optionally supports operating temperatures from -40°C to 85°C, making it suitable for extreme and high-vibration environments, while its guaranteed 10-year product lifecycle makes it the best choice for mission-critical embedded systems.
The OSM form factor is a compact compute module designed for solderable BGA mini-modules, supporting both ARM and x86 designs. At just 45mm x 45mm, these OSM Size-L modules deliver exceptional performance in a compact form factor.
Whether processing compute-intensive workloads or delivering real-time data, the compact OSM-MTK510 is designed to deliver exceptional performance, efficiency and versatility.
