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Parker's New Gap Filler Pad Offers Superior Thermal Conductivity and Performance

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70TP THERM-A-GAP™ PAD also offers ultra-soft conformability to combat uneven surfaces and air gaps

The Chomerics division of Parker Hannifin Corporation, a world leader in motion and control technologies, has launched the THERM-A-GAP™ 70TP PAD, an ultra-soft (15 Shore Hardness), highly conformable, high-performance, heat-conductive gap-filling pad for meet the demands of a wide range of demanding industrial applications.

70TP THERM-A-GAP™ PAD offers the combination of excellent thermal conductivity (7,0 W/mK) and ultra-soft conformability, along with very low outgassing. The result is an effective thermal interface between heat sinks and electronic devices, even where uneven surfaces, air gaps, or surface textures exist.

Providing superior thermal performance and long-term stability compared to conventional heating pads, typical uses for the 70TP THERM-A-GAP™ PAD range from telecom equipment and PC boards to chassis applications, BGAs (ball grid arrays), thermally enhanced memory modules and packages, GPU and CPU applications, and a host of industrial devices.

These applications and many more will benefit from the excellent thermal properties of the 70TP THERM-A-GAP™ PAD, including a thermal impedance of 0,27°C-in/w (at 10 psi, 1mm thickness) and a thermal capacity of 0,72 J/gK.

The product also offers impressive electrical insulation properties, with a volume resistivity of 1013 ohms-cm, plus low deflection force and low oil purge.

The latter is particularly important as it minimizes the generation of greasy substances on the surface of the substrate or heat sink during use. Oil purging of comparable products on the market can reduce electrical performance in the form of lower surface resistance and breakdown voltage. In addition, impurities and particles from the environment can be absorbed into or adhere to the oil, compromising the performance and life of the product.

Parker Chomerics custom fabricates the 70TP THERM-A-GAP™ PAD, making it easy to apply to the desired component. A fabric-backed version is available to improve tear resistance and ease handling. Suitable for use in a wide range of operating temperatures from -55 to +200°C, the new RoHS compliant void filler pads are available in standard thicknesses from 0,76 to 5,0mm.