KIOXIA Europe GmbH announced today that KIOXIA America Ltd. will be exhibiting the KIOXIA XL1 series, a Compute Express Link (CXL) compatible memory expansion module, at the KIOXIA booth at FMS: The Future of Memory and Storage, taking place August 4-6 in Santa Clara, California.
The product incorporates KIOXIA XL-FLASH™, a low-latency, high-performance flash memory technology that allows flash memory, traditionally used for storage applications, to also be used as a memory expansion solution.
Furthermore, it is being designed and developed to accommodate the growing volume of memory-intensive AI applications. Evaluation samples are scheduled to be shipped to industry ecosystem partners in August 2026.
In recent years, the growing number of AI workloads has significantly increased the demand for memory in data centers, leading to serious challenges such as capacity shortages and rising costs. In response to this critical market need, KIOXIA is developing an innovative memory expansion solution for hyperscale environments. The KIOXIA XL1 Series memory expansion module combines high-performance, low-latency XL-FLASH™ technology with a CXL interface, improving DRAM efficiency by storing less frequently accessed data within the module.
This module reduces the performance and cost gap between conventional DRAM and SSDs, allowing for memory expansion for demanding AI applications.
“As AI models and infrastructures continue to grow in complexity and scale, efficient memory utilization will be essential to meet the demands of increasingly data-intensive AI applications,” said Axel Störmann, Vice President and Chief Technology Officer of KIOXIA Europe GmbH. “KIOXIA’s XL1 memory expansion module is designed to address this challenge by combining the low latency of XL-FLASH with a CXL interface to extend the memory hierarchy, thereby improving DRAM utilization and enabling more efficient AI, HPC, and cloud computing infrastructures.”
The sample units are for evaluation purposes only. Some features may not have been fully tested, and specifications are subject to change.
