The new ChiP bus converter modules with 380V DC input enable high voltage DC distribution with a conversion efficiency of up to 98%.
48 V with a power density of 115 W/cm3
Vicor Corporation (NASDAQ: VICR) today launched the first module to market using its “Converter housed in Package” (ChiP) platform of power components. Vicor's new ChiP bus converter modules (BCM®) supply 1,2 kW at 48 V with a peak efficiency of 98% and a power density of 115 W/cm3. Its revolutionary features, which multiply the density of competitive solutions by 4, allow for an efficient high-voltage DC distribution infrastructure in data centers, telecommunications and industrial applications.
Platform Converter housed in Package (ChiP)
Vicor's ChiP platform establishes best-in-class performance for a new generation of scalable power modules. Leveraging advanced magnetic structures and embedded in high-density interconnect substrates with power semiconductors and control ASICs, ChiPs provide superior thermal management for unprecedented power density.
ChiPs, with their excellent thermal response, allow users to realize low cost power system solutions with previously unattainable characteristics in terms of system size, weight and efficiency, and in a fast and predictable manner.
The advent of ChiPs represents a modular power system design methodology for designers to achieve cost-effective, high-performance power systems from AC or DC sources to the point of charge using proven functional blocks.
“ChiPs will allow power system designers to overcome the power density restrictions imposed by conventional power solutions,” said Patrizio Vinciarelli, Vicor CEO. "ChiPs maximize performance while minimizing development cost and time to market, while offering superior solutions with the flexibility and scalability of modular building blocks."
New VI Chip bus converter modules
With a nominal input voltage of 380V and a K-factor of 1/8, Vicor's new ChiP BCM fixed ratio power converters supply an isolated 48V distributed bus with 98% peak efficiency. With its input range of 260 to 410 V, the new BCM generates output voltages from 32,5 V to 51,25 V. The BCMs are based on Vicor's ZCS/ZVS Sine Amplitude Converter™ topology and operate at a frequency 1,25 MHz switching frequency, providing fast response time and low noise operation. Supplied in the 380 ChiP package, the new 6123V DC BCM VI Chips measure 63mm by 23mm and are just 7,3mm high. Initially it is offered as a device for insertion, although there are SMD versions. ChiP BCMs can be paralleled to provide multi-kW arrays and can work bi-directionally to support battery backup and renewable energy applications. Standard features of the BCM include undervoltage/overvoltage, overcurrent, short circuit, and overtemperature lockout protection. ChiP BCMs incorporate digital telemetry and control functions that can be configured to suit customer requirements. “The deployment of high-voltage distributed DC infrastructure is delivering reduced power consumption and operating costs for data centers and industrial plants,” said Stephen Oliver, Vice President, VI Chip Product Line at Vicor. . “ChiP BCMs provide superior levels of efficiency, density and flexibility; the benefits that are the hallmark of the ChiP platform.”
Prices and availability
Vicor's new 6123 VI Chip BCM is now available. The price for OEM quantities is $120,00. For more information visit the website.
