Compact module delivers 39 TOPS AI performance

Congatec introduces the new COM Express Compact Computer-on-Modules with AMD Ryzen Embedded 8000 Series processors. Based on the dedicated compute cores of the new Ryzen processors featuring up to eight “Zen 4” cores, the innovative XDNA™ NPU and powerful Radeon RDNA 3™ graphics, the new modules deliver impressive performance of up to 39 teraoperations per second (TOPS) for AI inference.

This makes the new conga-TCR8 Type 6 modules particularly attractive for high-volume, price-sensitive applications requiring a combination of advanced AI, graphics, and computing power. OEMs in medical imaging, test and measurement, AI-enabled POS/POI systems, and professional gaming can take advantage of these long-available COM Express Compact modules to accelerate innovation while ensuring investment security. With a wide, scalable TDP range from 15 to 54 watts, these modules are also ideal for upgrading existing designs. By simply replacing the modules, companies can bring their products up to date with the latest technology, significantly improving lifecycle, ROI, and sustainability.

“Our new modules based on AMD Ryzen Embedded 8000 not only expand our portfolio of high-performance edge AI platforms for innovative applications, but also offer developers easy access to the benefits of system consolidation in the aReady.COM variant. Featuring powerful CPU, GPU and NPU cores, this new processor platform is perfectly suited for such consolidation. Customers and users benefit from advantages in terms of cost, efficiency and reliability thanks to a configured hypervisor, pre-installed operating systems, complementary IoT software for enhanced functionality and flexible expansion options,” explains Martin Danzer, Director of Product Management at congatec.

The feature set in detail

The new conga-TCR8 compute modules from congatec are available with four different AMD Ryzen Embedded 8000 processors with six or eight ‘Zen 4’ cores. They support up to 128 GB DDR5-5600 memory with error-correcting code (ECC) for data-intensive and data-critical applications. With the integrated AMD XDNA™ NPU (16 TOPS) and AMD Radeon RDNA™ 3 graphics, which can also be used as a GPGPU for AI tasks with up to 12 compute units, they offer a combined computing power of up to 39 TOPS. They also support immersive graphics output on up to four displays with resolutions up to 8k. For fast peripheral connectivity, they offer six PCIe Gen 4 (8 lanes) with PEG x8 Gen 4, three DisplayPort (DP), one eDP or LVDS, four USB 3.2 Gen 2 and four USB 2.0 ports. Audio signals are delivered via HAD and mass storage can be integrated via two SATA 6Gb/s ports or an optional NVMe SSD directly on the module. Classic integrated interfaces such as SPI, UART, I2C and GPIO complete the feature set.

The new COM Express Compact modules are also available as application-ready aReady.COM, with pre-installed and validated custom operating systems such as ctrlX OS, Ubuntu and/or RT Linux, optional system consolidation via aReady.VT and IoT connectivity via aReady.IOT. On request, the modules can be pre-installed with the customer’s application, allowing simple plug-and-play integration into the finished system.

In addition, congatec’s high-performance ecosystem and design services simplify the application development process. The service offering includes complete board support packages, production- and evaluation-ready application carrier boards, customized cooling solutions, extensive documentation and training, and high-speed signal integrity measurements.

The new COM Express Compact conga-TCR8 modules are available in the following variants:

You can find out more about the new conga-TCR8 modules at: conga-TCR8

For more information about the COM Express standard, visit: https://www.congatec.com/en/technologies/com-express/